In Situ, Real-Time Temperature Mapping and Thermal FE Simulations of Large-Format 3D Printed PETG/CF Vertical Wall
Published: 2023
Publication Name: Materials
Publication URL: https://www.mdpi.com/1996-1944/16/19/6486
Abstract:
This work focuses on simulating the thermal history of a vertical wall consisting of a thermoplastic composite material, poly(ethylene terephthalate) glycol (PETG) with short carbon fiber reinforcement, manufactured using a Big Area Additive Manufacturing (BAAM) system. The incremental deposition process used in additive manufacturing, which corresponds to the repeated deposition of hot material onto cooler material, contributes to the presence of residual stresses and part warping. The prediction of these mechanisms is dependent on thermal history of the part, and the major motivation of this work was to improve the accuracy of finite element (FE) models used to quantify the thermal history of large-format additively manufactured parts. Thermocouples were placed throughout the part at varying heights to measure temperature as a function of time. The FE model developed found a thermal contact conductance between the printed part and the bed of 10 W/m2K and convection coefficient values that linearly varied from 3 to 15 W/m2K through the wall height when making a temperature comparison with the output from the thermocouples. It is also demonstrated that the FE model with a constant convection coefficient under-predicts model temperature at the beginning of the manufacturing process when compared against the model with a variable convection coefficient. The impact of this difference was seen in the stress values, which were larger for the model with a constant convection coefficient. Finally, a correlation equation was derived which allows the findings to be generalized to other vertical structures manufactured on the BAAM. In summary, this work offers valuable insights on material characterization, real-time thermocouple placement, and FE modeling of large-format additively manufactured parts.